@article{asurveyofdetectionmethodsfordie,
  title = {A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing},
  author = {Lamia Alam and Nasser Kehtarnavaz},
  year = {2022},
  eprint = {2206.07481},
  archivePrefix = {arXiv},
  url = {https://arxiv.org/abs/2206.07481v2},
}